Bondtech Firmware Variation Updates For Prusa 3D Printers

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Firmware Updates For Prusa

Prusa is doing an amazing job on continuously improving the firmware they supply to run their 3D printers. Bondtech is also doing an amazing job, if we can say it ourselves, on adding value to the many already awesome Prusa printers. Our hardware does add something extra to the Prusa units, and because of that, we always need to sprinkle a bit of firmware magic dust to every new version Prusa releases.

This presents us, and our customers, some challenges we will try to overcome here. Below you will find several groups, each one relating to a specific Prusa Firmware version. Inside each group several tabs host the multiple versions we have prepared to be used with our products.

This list will be updated every time there is a new firmware version from Prusa, by keeping older versions on bottom, and the new on top.

Use only firmware that matches your hardware setup.

Instructions On How To Choose The Right Firmware:

  1. Identify the firmware version running your Prusa;
  2. To check which firmware version you already have in your printer, power it up and in the LCD menu, go to Support. Scroll down and you will see the firmware version.

  3. Identify your Prusa model to select the proper accordion tab inside each firmware tab;
  4. To check which printer model you have, in the LCD menu, you will see the model name in the bottom line of the main screen.

  5. Identify your Prusa’s mainboard version;
  6. In the LCD menu, go to Support. and scroll down to the second line below the
    – – – – – – – – – – – – – –
    and you will see the mainboard version (eg: RAMBo10a; RAMBo13a; EINSy10a;…).

  7. Identify any hardware setup variant you may have and relate it to the files available.
  8. Hardware setup variants include, so far, the presence of Slice Engineering HT Thermistor . Others may be added in the Future.

About the firmware files naming

The name of the firmware file you download should match your setup.

Take the following as an example:

notice the printer model:
bondtech_fw_MK25s_RAMBo10a_3.8.1-SliceE-HT-Mosquito_Magnum

notice the mainboard model:
bondtech_fw_MK25s_RAMBo10a_3.8.1-SliceE-HT-Mosquito_Magnum

notice the base Prusa firmware:
bondtech_fw_MK25s_RAMBo10a_3.8.1-SliceE-HT-Mosquito_Magnum

notice the HT thermistor:
bondtech_fw_MK25s_RAMBo10a_3.8.1-SliceE-HT-Mosquito_Magnum

notice the Mosquito Magnum hot end:
bondtech_fw_MK25s_RAMBo10a_3.8.1-SliceE-HT-Mosquito_Magnum

If there is no mention to thermistor or hotend models, the firmware file is used to the default ones supplied by Prusa in your 3D printer.

Based on 3.8.1 Firmware for MK3, MK3S, MK2.5 and MK2.5S

The firmware archives you will find below are based on the Prusa release mentioned above. All updates were done by Bondtech to optimize the usage of our hardware and sometimes to tweak specific features. You may find more information on the release notes below.

MMU2S Support

This firmware release supports Bondtech customers that are using the MMU2S with Prusa i3 MK25s or MK3s, and E3D or Mosquito hotends. Expand the tab that fits your 3D printer and choose the firmware file most adjusted to your configuration.

Slice Engineering High Temperature Thermistor

We also made versions to support Slice Engineering high temperature thermistor. We reduced the MINTEMP threshold to allow use in colder environments. The max temp was not changed. If you are an experienced and knowledgeable user you can change the HEATER_0_MAXTEMP parameter to fit your needs. Find the source code below. 

Summary of Bondtech Specific Changes

  • Variants for Slice Engineerings High temperature thermistor (SE_HT-thermistor)
  • Adjusted Load/Unload filament sequence
  • MK3/MK3s: Changed microstep resolution to 16
  • MK3s/MK25s: Changed Z_MAX_POS 205 to allow Z and XYZ calibration
  • MK3s/Mk25s with MMU2S: Adjusted mmu.cpp to correct values for extrusion positions on E3Dv6, Mosquito and Mosquito Magnum together with the Bondtech extruder when performing can_load and mmu_load_to_nozzle.

Click the link below to download all the source code files.

Source code.zip 1.02 MB

For MK3 Using AllMetal V6

Changes for MK3 (Using AllMetal V6)

  • #define CUSTOM_MENDEL_NAME “Bondtech-PE MK3”
  • #define DEFAULT_AXIS_STEPS_PER_UNIT{100,100,3200/8,415}
  • #define TMC2130_USTEPS_E16
  • #define LOAD_FILAMENT_1 “G1 E80 F400”
  • #define UNLOAD_FILAMENT_1 “G1 E-95 F7000”
  • #define FILAMENTCHANGE_FINALRETRACT -95
  • #define FILAMENTCHANGE_FIRSTFEED 80

For EINSy 10a Mainboards

For MK3S Using AllMetal V6

Changes for MK3s (Using AllMetal V6)

  • #define CUSTOM_MENDEL_NAME “Bondtech-PE MK3s”

  • #define BONDTECH_MK3S

  • #define DEFAULT_AXIS_STEPS_PER_UNIT{100,100,3200/8,415}

  • #define TMC2130_USTEPS_E16

  • #define Z_MAX_POS 205

  • #define LOAD_FILAMENT_1 “G1 E80 F400”

  • #define UNLOAD_FILAMENT_1 “G1 E-95 F7000”

  • #define FILAMENTCHANGE_FINALRETRACT -95

  • #define FILAMENTCHANGE_FIRSTFEED 80

  • #elif defined(BONDTECH_MK3S)
    current_position[E_AXIS] += 71; //Bondtech_V6 71mm from drive gear to melt zone

  • #elif defined(BONDTECH_MK3S)
    current_position[E_AXIS] -= 63; // Pull back 63mm, 8 mm below drive gear

  • #elif defined(BONDTECH_MK3S)
    current_position[E_AXIS] += 25.4f; //Bondtech MK2.5s 11 mm longer t melt zone

For EINSy 10a Mainboards

For MK3S Using Mosquito

Changes for MK3s Using Mosquito

  • #define CUSTOM_MENDEL_NAME “Bondtech-M MK3s”

  • #define BONDTECH_MOSQUITO

  • #define DEFAULT_AXIS_STEPS_PER_UNIT{100,100,3200/8,415}

  • #define TMC2130_USTEPS_E16

  • #define Z_MAX_POS 205

  • #define LOAD_FILAMENT_1 “G1 E80 F400”

  • #define UNLOAD_FILAMENT_1 “G1 E-95 F7000”

  • #define FILAMENTCHANGE_FINALRETRACT -95

  • #define FILAMENTCHANGE_FIRSTFEED 80

  • #elif defined(BONDTECH_MOSQUITO)
    current_position[E_AXIS] += 70; //Bondtech_Mosquito 70mm from drive gear to melt zone

  • #elif defined(BONDTECH_MOSQUITO)
    current_position[E_AXIS] -= 62; // Pull back 62mm, 8 mm below drive gear

  • #elif defined(BONDTECH_MOSQUITO)
    current_position[E_AXIS] += 23.4f; //Bondtech Mosquito 9 mm longer t melt zone

  • #ifdef BONDTECH_MOSQUITO
    current_position[E_AXIS] += 16.4f; //2mm further through Mosquito heat block

Changes for MK3s Using Mosquito With High Temperature Thermistor (SlicE_HT)

  • #define CUSTOM_MENDEL_NAME “Bondtech-M MK3s-HT “

  • #define BONDTECH_MOSQUITO

  • #define HEATER_0_MINTEMP 5

  • #define DEFAULT_AXIS_STEPS_PER_UNIT{100,100,3200/8,415}

  • #define TMC2130_USTEPS_E16

  • #define Z_MAX_POS 205

  • #define LOAD_FILAMENT_1 “G1 E80 F400”

  • #define UNLOAD_FILAMENT_1 “G1 E-95 F7000”

  • #define FILAMENTCHANGE_FINALRETRACT -95

  • #define FILAMENTCHANGE_FIRSTFEED 80

  • #elif defined(BONDTECH_MOSQUITO)
    current_position[E_AXIS] += 70; //Bondtech_Mosquito 70mm from drive gear to melt zone

  • #elif defined(BONDTECH_MOSQUITO)
    current_position[E_AXIS] -= 62; // Pull back 62mm, 8 mm below drive gear

  • #elif defined(BONDTECH_MOSQUITO)
    current_position[E_AXIS] += 23.4f; //Bondtech Mosquito 9 mm longer t melt zone

  • #ifdef BONDTECH_MOSQUITO
    current_position[E_AXIS] += 16.4f; //2mm further through Mosquito heat block

For EINSy 10a Mainboards

For MK3S Using Mosquito Magnum

Changes for MK3s Using Mosquito Magnum

  • #define CUSTOM_MENDEL_NAME “Bondtech-MM MK3s”

  • #define BONDTECH_MOSQUITO_MAGNUM

  • #define DEFAULT_AXIS_STEPS_PER_UNIT{100,100,3200/8,415}

  • #define TMC2130_USTEPS_E16

  • #define Z_MAX_POS 205

  • #define LOAD_FILAMENT_1 “G1 E80 F400”

  • #define UNLOAD_FILAMENT_1 “G1 E-95 F7000”

  • #define FILAMENTCHANGE_FINALRETRACT -95

  • #define FILAMENTCHANGE_FIRSTFEED 80

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] += 62; //Bondtech_Mosquito_Magnum 62mm from drive gear to melt zone

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] -= 54; // Pull back 54mm, 8 mm below drive gear

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] += 18.4f; //Bondtech Mosquito Magnum 4 mm longer t melt zone

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] += 21.4f; //7mm further through Mosquito Magnum heat block

Changes for MK3s Using Mosquito Magnum With High Temperature Thermistor (SlicE_HT)

  • #define CUSTOM_MENDEL_NAME “Bondtech-MM MK3s-HT”

  • #define BONDTECH_MOSQUITO_MAGNUM

  • #define HEATER_0_MINTEMP 5

  • #define DEFAULT_AXIS_STEPS_PER_UNIT{100,100,3200/8,415}

  • #define TMC2130_USTEPS_E16

  • #define Z_MAX_POS 205

  • #define LOAD_FILAMENT_1 “G1 E80 F400”

  • #define UNLOAD_FILAMENT_1 “G1 E-95 F7000”

  • #define FILAMENTCHANGE_FINALRETRACT -95

  • #define FILAMENTCHANGE_FIRSTFEED 80

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] += 62; //Bondtech_Mosquito_Magnum 62mm from drive gear to melt zone

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] -= 54; // Pull back 54mm, 8 mm below drive gear

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] += 18.4f; //Bondtech Mosquito Magnum 4 mm longer t melt zone

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] += 21.4f; //7mm further through Mosquito Magnum heat block

For EINSy 10a Mainboards

For MK2.5 Using AllMetal V6

Changes for MK2.5 (Using AllMetal V6)

  • #define CUSTOM_MENDEL_NAME “Bondtech-PE MK2.5”
  • #define DEFAULT_AXIS_STEPS_PER_UNIT{100,100,3200/8,415}
  • #define LOAD_FILAMENT_1 “G1 E80 F400”
  • #define UNLOAD_FILAMENT_1 “G1 E-95 F7000”
  • #define FILAMENTCHANGE_FINALRETRACT -95
  • #define FILAMENTCHANGE_FIRSTFEED 80

For RAMBo 10a Mainboards

For RAMBo 13a Mainboards

For MK2.5S Using AllMetal V6

Changes for MK2.5s (Using AllMetal V6)

  • #define CUSTOM_MENDEL_NAME “Bondtech-PE MK2.5S”

  • #define BONDTECH_MK25S

  • #define DEFAULT_AXIS_STEPS_PER_UNIT{100,100,3200/8,415}

  • #define Z_MAX_POS 205

  • #define LOAD_FILAMENT_1 “G1 E80 F400”

  • #define UNLOAD_FILAMENT_1 “G1 E-95 F7000”

  • #define FILAMENTCHANGE_FINALRETRACT -95

  • #define FILAMENTCHANGE_FIRSTFEED 80

  • #ifdef BONDTECH_MK25S //feed to melt zone
    current_position[E_AXIS] += 71; //Bondtech_V6 71mm from drive gear to melt zone

  • #ifdef BONDTECH_MK25S
    current_position[E_AXIS] -= 63; // Pull back 63mm, 8 mm below drive gear

  • #ifdef BONDTECH_MK25S
    current_position[E_AXIS] += 25.4f; //Bondtech MK2.5s 11 mm longer t melt zone

For RAMBo 10a Mainboards

For RAMBo 13a Mainboards

For MK2.5S Using Mosquito

Changes for MK2.5s Using Mosquito

  • #define CUSTOM_MENDEL_NAME “Bondtech-M MK2.5S”

  • #define BONDTECH_MOSQUITO

  • #define DEFAULT_AXIS_STEPS_PER_UNIT{100,100,3200/8,415}

  • #define Z_MAX_POS 205

  • #define LOAD_FILAMENT_1 “G1 E80 F400”

  • #define UNLOAD_FILAMENT_1 “G1 E-95 F7000”

  • #define FILAMENTCHANGE_FINALRETRACT -95

  • #define FILAMENTCHANGE_FIRSTFEED 80

  • #elif defined(BONDTECH_MOSQUITO)
    current_position[E_AXIS] += 70; //Bondtech_Mosquito 70mm from drive gear to melt zone

  • #elif defined(BONDTECH_MOSQUITO)
    current_position[E_AXIS] -= 62; // Pull back 62mm, 8 mm below drive gear

  • #elif defined(BONDTECH_MOSQUITO)
    current_position[E_AXIS] += 23.4f; //Bondtech Mosquito 9 mm longer t melt zone

  • #ifdef BONDTECH_MOSQUITO
    current_position[E_AXIS] += 16.4f; //2mm further through Mosquito heat block

Changes for MK2.5s Using Mosquito With High Temperature Thermistor (SlicE_HT)

  • #define CUSTOM_MENDEL_NAME “Bondtech-M MK2.5S-HT”

  • #define BONDTECH_MOSQUITO

  • #define DEFAULT_AXIS_STEPS_PER_UNIT{100,100,3200/8,415}

  • #define HEATER_0_MINTEMP 10

  • #define Z_MAX_POS 205

  • #define LOAD_FILAMENT_1 “G1 E80 F400”

  • #define UNLOAD_FILAMENT_1 “G1 E-95 F7000”

  • #define FILAMENTCHANGE_FINALRETRACT -95

  • #define FILAMENTCHANGE_FIRSTFEED 80

  • #elif defined(BONDTECH_MOSQUITO)
    current_position[E_AXIS] += 70; //Bondtech_Mosquito 70mm from drive gear to melt zone

  • #elif defined(BONDTECH_MOSQUITO)
    current_position[E_AXIS] -= 62; // Pull back 62mm, 8 mm below drive gear

  • #elif defined(BONDTECH_MOSQUITO)
    current_position[E_AXIS] += 23.4f; //Bondtech Mosquito 9 mm longer t melt zone

  • #ifdef BONDTECH_MOSQUITO
    current_position[E_AXIS] += 16.4f; //2mm further through Mosquito heat block

For RAMBo 10a Mainboards

For RAMBo 13a Mainboards

For MK2.5S Using Mosquito Magnum

Changes for MK2.5s Using Mosquito Magnum

  • #define CUSTOM_MENDEL_NAME “Bondtech-MM MK2.5S”

  • #define BONDTECH_MOSQUITO_MAGNUM

  • #define DEFAULT_AXIS_STEPS_PER_UNIT{100,100,3200/8,415}

  • #define Z_MAX_POS 205

  • #define LOAD_FILAMENT_1 “G1 E80 F400”

  • #define UNLOAD_FILAMENT_1 “G1 E-95 F7000”

  • #define FILAMENTCHANGE_FINALRETRACT -95

  • #define FILAMENTCHANGE_FIRSTFEED 80

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] += 62; //Bondtech_Mosquito_Magnum 62mm from drive gear to melt zone

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] -= 54; // Pull back 54mm, 8 mm below drive gear

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] += 18.4f; //Bondtech Mosquito Magnum 4 mm longer t melt zone

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] += 21.4f; //7mm further through Mosquito Magnum heat block

Changes for MK2.5s Using Mosquito Magnum With High Temperature Thermistor (SlicE_HT)

  • #define CUSTOM_MENDEL_NAME “Bondtech-MM MK2.5S-HT”

  • #define BONDTECH_MOSQUITO_MAGNUM

  • #define DEFAULT_AXIS_STEPS_PER_UNIT{100,100,3200/8,415}

  • #define HEATER_0_MINTEMP 10

  • #define Z_MAX_POS 205

  • #define LOAD_FILAMENT_1 “G1 E80 F400”

  • #define UNLOAD_FILAMENT_1 “G1 E-95 F7000”

  • #define FILAMENTCHANGE_FINALRETRACT -95

  • #define FILAMENTCHANGE_FIRSTFEED 80

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] += 62; //Bondtech_Mosquito_Magnum 62mm from drive gear to melt zone

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] -= 54; // Pull back 54mm, 8 mm below drive gear

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] += 18.4f; //Bondtech Mosquito Magnum 4 mm longer t melt zone

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] += 21.4f; //7mm further through Mosquito Magnum heat block

For RAMBo 10a Mainboards

For RAMBo 13a Mainboards

Based on 3.8.0 Firmware for MK3, MK3S, MK2.5 and MK2.5S

The firmware archives you will find below are based on the Prusa release mentioned above. All updates were done by Bondtech to optimize the usage of our hardware and sometimes to tweak specific features. You may find more information on the release notes below.

MMU2S Support

This firmware release supports Bondtech customers that are using the MMU2S with Prusa i3 MK25s or MK3s, and E3D or Mosquito hotends. Expand the tab that fits your 3D printer and choose the firmware file most adjusted to your configuration.

Slice Engineering High Temperature Thermistor

We also made versions to support Slice Engineering high temperature thermistor. We reduced the MINTEMP threshold to allow use in colder environments. The max temp was not changed. If you are an experienced and knowledgeable user you can change the HEATER_0_MAXTEMP parameter to fit your needs. Find the source code below. 

Summary of Bondtech Specific Changes

  • Updated mmu.cpp to correct values for E3Dv6, Mosquito and Mosquito Magnum together with the Bondtech extruder when performing can_load and mmu_load_to_nozzle.
  • Changed HEATER_0_MINTEMP for Slice Engineering’s High-Temperature thermistor to reduce MINTEMP threshold.

Click the link below to download all the source code files.

Source code.zip 1.02 MB

For MK3S Using AllMetal V6

New changes for MK3s (Using AllMetal V6)

  • #define CUSTOM_MENDEL_NAME “Bondtech-PE MK3s”

  • #define BONDTECH_MK3S

  • #elif defined(BONDTECH_MK3S)
    current_position[E_AXIS] += 71; //Bondtech_V6 71mm from drive gear to melt zone

  • #elif defined(BONDTECH_MK3S)
    current_position[E_AXIS] -= 63; // Pull back 63mm, 8 mm below drive gear

  • #elif defined(BONDTECH_MK3S)
    current_position[E_AXIS] += 25.4f; //Bondtech MK2.5s 11 mm longer t melt zone

For EINSy 10a Mainboards

For MK3S Using Mosquito

New changes for MK3s Using Mosquito

  • #define CUSTOM_MENDEL_NAME “Bondtech-M MK3s”

  • #define BONDTECH_MOSQUITO

  • #elif defined(BONDTECH_MOSQUITO)
    current_position[E_AXIS] += 70; //Bondtech_Mosquito 70mm from drive gear to melt zone

  • #elif defined(BONDTECH_MOSQUITO)
    current_position[E_AXIS] -= 62; // Pull back 62mm, 8 mm below drive gear

  • #elif defined(BONDTECH_MOSQUITO)
    current_position[E_AXIS] += 23.4f; //Bondtech Mosquito 9 mm longer t melt zone

  • #ifdef BONDTECH_MOSQUITO
    current_position[E_AXIS] += 16.4f; //2mm further through Mosquito heat block

New changes for MK3s Using Mosquito With High Temperature Thermistor (SlicE_HT)

  • #define CUSTOM_MENDEL_NAME “Bondtech-M MK3s-HT “

  • #define BONDTECH_MOSQUITO

  • #define HEATER_0_MINTEMP 5

  • #elif defined(BONDTECH_MOSQUITO)
    current_position[E_AXIS] += 70; //Bondtech_Mosquito 70mm from drive gear to melt zone

  • #elif defined(BONDTECH_MOSQUITO)
    current_position[E_AXIS] -= 62; // Pull back 62mm, 8 mm below drive gear

  • #elif defined(BONDTECH_MOSQUITO)
    current_position[E_AXIS] += 23.4f; //Bondtech Mosquito 9 mm longer t melt zone

  • #ifdef BONDTECH_MOSQUITO
    current_position[E_AXIS] += 16.4f; //2mm further through Mosquito heat block

For EINSy 10a Mainboards

For MK3S Using Mosquito Magnum

New changes for MK3s Using Mosquito Magnum

  • #define CUSTOM_MENDEL_NAME “Bondtech-MM MK3s”

  • #define BONDTECH_MOSQUITO_MAGNUM

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] += 62; //Bondtech_Mosquito_Magnum 62mm from drive gear to melt zone

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] -= 54; // Pull back 54mm, 8 mm below drive gear

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] += 18.4f; //Bondtech Mosquito Magnum 4 mm longer t melt zone

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] += 21.4f; //7mm further through Mosquito Magnum heat block

New changes for MK3s Using Mosquito Magnum With High Temperature Thermistor (SlicE_HT)

  • #define CUSTOM_MENDEL_NAME “Bondtech-MM MK3s-HT”

  • #define BONDTECH_MOSQUITO_MAGNUM

  • #define HEATER_0_MINTEMP 5

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] += 62; //Bondtech_Mosquito_Magnum 62mm from drive gear to melt zone

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] -= 54; // Pull back 54mm, 8 mm below drive gear

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] += 18.4f; //Bondtech Mosquito Magnum 4 mm longer t melt zone

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] += 21.4f; //7mm further through Mosquito Magnum heat block

For EINSy 10a Mainboards

For MK2.5S Using AllMetal V6

New changes for MK2.5s (Using AllMetal V6)

  • #define CUSTOM_MENDEL_NAME “Bondtech-PE MK2.5S”

  • #define BONDTECH_MK25S

  • #ifdef BONDTECH_MK25S //feed to melt zone
    current_position[E_AXIS] += 71; //Bondtech_V6 71mm from drive gear to melt zone

  • #ifdef BONDTECH_MK25S
    current_position[E_AXIS] -= 63; // Pull back 63mm, 8 mm below drive gear

  • #ifdef BONDTECH_MK25S
    current_position[E_AXIS] += 25.4f; //Bondtech MK2.5s 11 mm longer t melt zone

For RAMBo 10a Mainboards

For RAMBo 13a Mainboards

For MK2.5S Using Mosquito

New changes for MK2.5s Using Mosquito

  • #define CUSTOM_MENDEL_NAME “Bondtech-M MK2.5S”

  • #define BONDTECH_MOSQUITO

  • #elif defined(BONDTECH_MOSQUITO)
    current_position[E_AXIS] += 70; //Bondtech_Mosquito 70mm from drive gear to melt zone

  • #elif defined(BONDTECH_MOSQUITO)
    current_position[E_AXIS] -= 62; // Pull back 62mm, 8 mm below drive gear

  • #elif defined(BONDTECH_MOSQUITO)
    current_position[E_AXIS] += 23.4f; //Bondtech Mosquito 9 mm longer t melt zone

  • #ifdef BONDTECH_MOSQUITO
    current_position[E_AXIS] += 16.4f; //2mm further through Mosquito heat block

New changes for MK2.5s Using Mosquito With High Temperature Thermistor (SlicE_HT)

  • #define CUSTOM_MENDEL_NAME “Bondtech-M MK2.5S-HT”

  • #define BONDTECH_MOSQUITO

  • #define HEATER_0_MINTEMP 10

  • #elif defined(BONDTECH_MOSQUITO)
    current_position[E_AXIS] += 70; //Bondtech_Mosquito 70mm from drive gear to melt zone

  • #elif defined(BONDTECH_MOSQUITO)
    current_position[E_AXIS] -= 62; // Pull back 62mm, 8 mm below drive gear

  • #elif defined(BONDTECH_MOSQUITO)
    current_position[E_AXIS] += 23.4f; //Bondtech Mosquito 9 mm longer t melt zone

  • #ifdef BONDTECH_MOSQUITO
    current_position[E_AXIS] += 16.4f; //2mm further through Mosquito heat block

For RAMBo 10a Mainboards

For RAMBo 13a Mainboards

For MK2.5S Using Mosquito Magnum

New changes for MK2.5s Using Mosquito Magnum

  • #define CUSTOM_MENDEL_NAME “Bondtech-MM MK2.5S”

  • #define BONDTECH_MOSQUITO_MAGNUM

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] += 62; //Bondtech_Mosquito_Magnum 62mm from drive gear to melt zone

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] -= 54; // Pull back 54mm, 8 mm below drive gear

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] += 18.4f; //Bondtech Mosquito Magnum 4 mm longer t melt zone

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] += 21.4f; //7mm further through Mosquito Magnum heat block

New changes for MK2.5s Using Mosquito Magnum With High Temperature Thermistor (SlicE_HT)

  • #define CUSTOM_MENDEL_NAME “Bondtech-MM MK2.5S-HT”

  • #define BONDTECH_MOSQUITO_MAGNUM

  • #define HEATER_0_MINTEMP 10

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] += 62; //Bondtech_Mosquito_Magnum 62mm from drive gear to melt zone

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] -= 54; // Pull back 54mm, 8 mm below drive gear

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] += 18.4f; //Bondtech Mosquito Magnum 4 mm longer t melt zone

  • #elif defined(BONDTECH_MOSQUITO_MAGNUM)
    current_position[E_AXIS] += 21.4f; //7mm further through Mosquito Magnum heat block

For RAMBo 10a Mainboards

For RAMBo 13a Mainboards

Based on 3.8.0 Firmware for MK3, MK3S, MK2.5 and MK2.5S

The firmware archives you will find below are based on the Prusa release mentioned above. All updates were done by Bondtech to optimize the usage of our hardware and sometimes to tweak specific features. You may find more information on the release notes below.

Summary of Bondtech changes

  • Variants for Slice Engineerings High temperature thermistor (SE_HT-thermistor)
  • Adjusted Load/Unload filament sequence
  • MK3s: Changed Z_MAX_POS 205 to allow Z and XYZ calibration
  • MK3s: Changed microstep resolution to 16

Click the link below to download all the source code files.

Source code.zip 994 KB

For MK3S Using E3D Thermistor

Changes for MK3s

  • #define CUSTOM_MENDEL_NAME “Bondtech-PE MK3s”
  • #define DEFAULT_AXIS_STEPS_PER_UNIT{100,100,3200/8,415}
  • #define Z_MAX_POS 205
  • #define TMC2130_USTEPS_E16
  • #define LOAD_FILAMENT_1 “G1 E80 F400”
  • #define UNLOAD_FILAMENT_1 “G1 E-95 F7000”
  • #define FILAMENTCHANGE_FINALRETRACT -95
  • #define FILAMENTCHANGE_FIRSTFEED 80

For EINSy 10a Mainboards

For MK3S Using Slice Engineering HT-Thermistor

Changes for MK3s

  • #define CUSTOM_MENDEL_NAME “Bondtech-PE MK3s”
  • #define DEFAULT_AXIS_STEPS_PER_UNIT{100,100,3200/8,415}
  • #define Z_MAX_POS 205
  • #define TMC2130_USTEPS_E16
  • #define LOAD_FILAMENT_1 “G1 E80 F400”
  • #define UNLOAD_FILAMENT_1 “G1 E-95 F7000”
  • #define FILAMENTCHANGE_FINALRETRACT -95
  • #define FILAMENTCHANGE_FIRSTFEED 80
  • #define TEMP_SENSOR_0 800
  • Slice Engineering thermistor table

For EINSy 10a Mainboards

For MK3

Changes for MK3

  • #define CUSTOM_MENDEL_NAME “Bondtech-PE MK3”
  • #define DEFAULT_AXIS_STEPS_PER_UNIT{100,100,3200/8,415}
  • #define TMC2130_USTEPS_E16
  • #define LOAD_FILAMENT_1 “G1 E80 F400”
  • #define UNLOAD_FILAMENT_1 “G1 E-95 F7000”
  • #define FILAMENTCHANGE_FINALRETRACT -95
  • #define FILAMENTCHANGE_FIRSTFEED 80

For EINSy 10a Mainboards

For MK2.5S Using E3D Thermistor

Changes for MK2.5s

  • #define CUSTOM_MENDEL_NAME “Bondtech-PE MK2.5S”
  • #define DEFAULT_AXIS_STEPS_PER_UNIT{100,100,3200/8,415}
  • #define LOAD_FILAMENT_1 “G1 E80 F400”
  • #define UNLOAD_FILAMENT_1 “G1 E-95 F7000”
  • #define FILAMENTCHANGE_FINALRETRACT -95
  • #define FILAMENTCHANGE_FIRSTFEED 80

For RAMBo 10a Mainboards

For RAMBo 13a Mainboards

For MK2.5S Using Slice Engineering HT-Thermistor

Changes for MK2.5s

  • #define CUSTOM_MENDEL_NAME “Bondtech-PE MK2.5S”
  • #define DEFAULT_AXIS_STEPS_PER_UNIT{100,100,3200/8,415}
  • #define LOAD_FILAMENT_1 “G1 E80 F400”
  • #define UNLOAD_FILAMENT_1 “G1 E-95 F7000”
  • #define FILAMENTCHANGE_FINALRETRACT -95
  • #define FILAMENTCHANGE_FIRSTFEED 80
  • #define TEMP_SENSOR_0 800
  • Slice Engineering thermistor table

For RAMBo 10a Mainboards

For RAMBo 13a Mainboards

For MK2.5

Changes for MK2.5

  • #define CUSTOM_MENDEL_NAME “Bondtech-PE MK2.5”
  • #define DEFAULT_AXIS_STEPS_PER_UNIT{100,100,3200/8,415}
  • #define LOAD_FILAMENT_1 “G1 E80 F400”
  • #define UNLOAD_FILAMENT_1 “G1 E-95 F7000”
  • #define FILAMENTCHANGE_FINALRETRACT -95
  • #define FILAMENTCHANGE_FIRSTFEED 80

For RAMBo 10a Mainboards

For RAMBo 13a Mainboards

Based on 3.7.2 Firmware for MK3, MK3S, MK2.5 and MK2.5S

The firmware archives you will find below are based on the Prusa release mentioned above. All updates were done by Bondtech to optimize the usage of our hardware and sometimes to tweak specific features. You may find more information on the release notes below.

Summary of Bondtech changes

  • E-step set to 830.
  • Z_MAX_POS 204 to allow Z and XYZ calibration.
  • Changed printer name.

Click the link below to download all the source code files.

Source code.zip 899 KB

For MK3S

Changes for MK3S

For RAMBo 10a Mainboards

For MK3

Changes for MK3

For RAMBo 10a Mainboards

No specific firmware is available for this selection

For MK2.5S

Changes for MK2.5S

For RAMBo 10a Mainboards

For RAMBo 13a Mainboards

For MK2.5

Changes for MK2.5

For RAMBo 10a Mainboards

No specific firmware is available for this selection

For RAMBo 13a Mainboards

No specific firmware is available for this selection